D-PAK-3 (ROHS)
| 門市據點 | 各店庫存 | 門市儲位 | 位置圖 | 倉庫儲位 | 位置圖 |
| 龍山門市 | 0 |  | | ||
| 光復門市 | 75 | 170-2-06-B | | 170-F-19 | |
- 特性
IR-IRF5210SPBF-HEXFET 電源 MOSFET
Feature
●Advanced Process Technology
●Surface Mount (IRF5210S)
●Low-profile through-hole (IRF5210L)
●175°C Operating Temperature
●Fast Switching
●P-Channel
●Fully Avalanche Rated
Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRF5210L) is available for low profile applications.
