AMTECH_100g/瓶 助焊膏

AMTECH_100g/瓶 助焊膏

Product Description

 Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes  Low voiding  Contains UV Tracer  Clear residue

Alloys

AMTECH manufactures a low-oxide, spherical and uniformly sized powder. NC-559-ASM is available in the following alloys: 63Sn/37Pb, 62Sn/36Pb/2Ag, 60Sn/Pb40,43Sn/43Pb/14Bi, 42Sn/58Bi, 10Sn/88Pb/2Ag and 10Sn/90Pb

Available Packaging

The following packaging options are available for stencil printing and dispensing applications: 250g and 500g jars; 250g and 700g cartridges; 750g ProFlow® cassettes; 35g and 100g syringes;2,500g FreshMix® Kits.

Stencil Life

>8 hrs. @ 30–45% RH & 22–25°C
~4 hrs. @ 45–70% RH & 22–25°C

Viscosity

Printing applications: 900 to 1,200Kcps +/-10%
Dispensing applications: 425Kcps +/-10%
Tested according to IPC-TM-650

Tack Value

Typical tackiness: 54g force

Printing

The print definition of NC-559-ASM is ideal for fine pitchapplications. The stencil life of this no-clean product virtually eliminates waste of solder paste. Consult the powder distribution chart to determine your mesh size requirements.

Printer Operation

The following are general guidelines for stencil printer optimization with NC-559-ASM . Some adjustments may be necessary based on your process requirements.

Print Speed: 25–100mm/sec

Squeegee Pressure: 0.2–0.7kg/inch of blade Under Stencil Wipe: Once every 10–25 prints or as necessary

Stencil Cleaning

Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well.

Storage and Handling Procedures

Refrigerated storage at 42–47°F will prolong the solder paste shelf life to no less than 6 months. Syringes & cartridges should be stored vertically with the dispensing tip down. Solder paste should be allowed to reach ambient temperature naturally, prior to use (about 6-8 hours). NEVER FREEZE SOLDER PASTE.